Smiths interconnect 史密斯英特康 |
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| Semiconductor Test Socket | |
| QN-series | Plastronics 测试座 老化座 |
| ESJ Series H-Pin Socket | 高性能老化插座，带双锁蛤壳盖，在盖子启动时为DUT提供共面压力。 High-performance burn-in socket, with dual latch clamshell lid to provide co-planar pressure on the DUT when the lid is actuated. |
| Kepler Test Socket | 外围IC的高性能擦洗接触技术开普勒接触技术将悬臂接触的擦洗运动与弹簧探头的多功能性和模块化相结合。该设计包括在器件向下冲程期间的水平移动，以去除表面氧化物，提供稳定可靠的接触，并且不会对PCB造成损坏。 High performance scrub contact technology for Peripheral IC The Kepler contact technology combines the scrub motion of a cantilever contact with the versatility and modularity of a spring probe. The design includes horizontal movement during the downward stroke of the device to remove surface oxides, provide stable and reliable contact, and cause no damage to the PCB. |
| K Series H-Pin® Socket | K系列插座设计用于在盖子关闭后，用辅助杠杆对DUT施加均匀的压力。这是为了确保在关闭可能标记设备的盖子时，压板不会滑过设备顶部。这对于外露模具产品或汽车应用尤为重要，因为外观是测试后合格/不合格验收标准的一部分。垂直杠杆驱动不会增加整体插座占地面积，允许老化板上的人口密度最高，在某些情况下，与其他蛤壳式插座相比，可以减少整体占地面积。K系列盖子的另一个额外好处是，由于轮廓更高，气流可以通过插座，从而允许更大的空气通道来帮助保持准确的温度。 The K-Series socket is designed to apply flat even pressure on the DUT with a secondary lever once the lid has been closed. This is to ensure that the platen does not skid across the top of the device when closing the lid potentially marking the device. This is especially important for exposed die products, or automotive applications where appearance is part of the pass/fail acceptance criteria post test. The vertical lever actuation does not increase the overall socket footprint, allowing for the highest density of populated sites on the burn-in board and in some cases reduces the overall footprint compared to other clamshell lid sockets. Another added benefit of the K-Series lid is airflow through the socket due to the taller profile, allowing for larger air channels to help maintain accurate temperatures. |
| M-Series H-Pin® Socket | M系列插座长期以来一直是可靠性和开箱即用性能老化插座的黄金标准。高质量的组件在其生命周期内经过改进和增强，以实现最佳性能和最高质量。M系列是产品组合中最成熟的产品之一，但这并不意味着它缺乏技术。事实上，恰恰相反，M系列提供了所有相同的可配置功能和高性能H引脚接触技术，超越了最苛刻应用的性能预期。M系列一直被认为能够提供一代又一代毫不妥协的性能。小外形尺寸提供了设计灵活性，并允许在老化板上实现高插座密度。 M-Series socket has long been the gold standard for reliability and out-of-the-box performance burn-in sockets. The high-quality components have been refined and enhanced over their lifetime for optimum performance and the highest quality. M-Series being one of the most mature products in the portfolio does not mean it lacks technology. In fact, quite the opposite, the M-Series offers all the same configurable features and high performance H-Pin contact technology to exceed performance expectations of the most demanding applications. The M-Series has been trusted to deliver uncompromised performance generation after generation. The small outline footprint provides design flexibility and allows for high socket density on the burn-in board. |
| Levan Elastomeric Contact Test Socket | Levan弹性体插座系列是专门精密设计的。Levan的弹性网格具有导电柱，可保证在各种设备上获得准确和一致的测试结果。 The Levan Elastomeric socket family is engineered specifically with precision. The elastomeric grid of Levan features conductive columns that guarantee accurate and consistent test results across a spectrum of devices. |
| Peripheral Strip Test | 高可靠性多工位条形测试插座。定制设计，适合任何条形测试处理器。 Highly reliable multi site strip test socket . Customized design to suite any strip test handler. |
| Q-Series H-Pin® Socket | 适用于中大型封装尺寸，具有完全模制的插座主体和盖子，旨在满足各种加速寿命测试应用的严格要求。 Available for mid to large package sizes with a fully molded socket body and lid designed to meet the rigors of a wide variety of accelerated life testing applications. |
| Peripheral Tri-Temp Test | 摄氏度测试插座采用擦拭接触技术，非常适合QFN测试。 Celsius test sockets feature a wiping contact technology perfect for QFN testing. |
| QN-Series | 这些插座采用模块化设计，外形小巧，电感非常低。开放式顶部QFN插座允许在与有盖版本相同的大多数引线数量选项中更方便地装载和卸载封装。 These sockets offer a modular design in a small outline with very low inductance. Open Top QFN socket allows for more convenient package loading and unloading in most of the same lead count options as the lidded version. |
| R-Series H-Pin® Socket | 用于加速寿命测试的开放式可靠性插座。压缩安装的开放式顶部设计版本可作为市场上其他传统产品的直接替代品。 Open-top reliability socket used for accelerated life testing. With versions of the compression mount open-top design available as a drop-in replacement for other legacy products on the market. |
| Standard Array & Peripheral Test | 为任何IC封装定制测试插座。适用于实验室、工程、SLT&；ATE测试应用程序。 Customized test sockets for any IC packages. Suitable for lab, Engineering, SLT & ATE test applications. |
| Thermal Management Lid Capabilities | 热管理盖解决方案是高价值的变体，包括空气冷却或液体冷却技术，能够耗散高达650瓦的功率。 Thermal Management Lid solutions are high value variations, including air-chilled or liquid cooled technology, capable of dissipating up to 650 Watts. |
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