CSP封装老化测试座
778 Series OTCSP Pinch Socket
Open Top Chip Scale Package
Accommodates pitch size of 0.80mm x 1.00mm
Compact size and Low Actuation Force
4-Point pinch design for enhanced electrical contact
Unique mechanism to eliminate solder ball sticking
Maximum package size is 11.0 x 18.5mm
| Pitch e(mm) |
Ball Count |
Package Size |
Matrix Contact |
Ball Dia.(mm) | Ball Height (mm) | Contact Plating | Part Number | Socket Out line(mm) |
MFR. |
| 0.80 X 1.0 | 55 | 11 X 18.5 | 12 X 18 | 0.35 |
0.24 |
Au |
778A1055-101 | 19.5 x 26 | WELLS-CTI |
| 55 | 11 X 18.5 | 12 X 18 | 0.51 |
0.39 |
Au |
778A1055-102 | 19.5 x 26 | WELLS-CTI | |
| 144 | 11 X 18.5 | 12 X 18 | 0.35 |
0.24 |
Au |
778A1144-101 | 19.5 x 26 | WELLS-CTI | |
| 144 | 11 X 18.5 | 12 X 18 | 0.51 |
0.39 |
Au |
778A1144-102 | 19.5 x 26 | WELLS-CTI |