H-Pin

Stamped contact

Robust contact

solution for burn-in,

programming,

and system-level

applications.

Benefits

■ Compliancy for large package warpage

■ Stable contact resistance and force

■ Solid beam electrical performance

■ Compliancy at high temperatures (180°C)

■ Correlated bi, system evaluation and test

■ Reliable power and ground contact

■ Stocked inventory and better lead time

■ High volume capacity, quality control, and ease of

use

The H-Pin is a stamped spring probe

with the mechanical, electrical, and

thermal performance of a spring probe,

and the ease of use and high volume

manufacturability of a stamped contact.

The H-Pin serves applications without the

typical compromises that are generally

required when considering cost versus

performance.

Feature Options

■ 0.40 mm to 0.70 mm travel

■ Flat-spring rate

■ BeCu H-Pin

■ Stainless steel core spring

■ Bandwidth –1dB @ 15 GHz

■ Current carrying capacity

■ High-volume stamping

■ Reel-to-reel pin insertion

Excellent mechanical and electrical

performance.

Utilizing high volume BeCu stamping technology, combined

with a stainless steel spring for mechanical travel, the H-Pin

has a working range up to 0.70 mm with a flat spring rate and

can be utilized up to 15 GHz with –1.0 dB loss, carry up to 4 A

of current and withstand temperatures up to 200°C.

High volume stamping and quality control.

From pin one to one million, you’ll get the same pin every

time. Because of our automated H-Pin manufacturing process,

you’ll be the first person to make contact with your pins.

H-Pin detail, showing full

deflection (right).

深圳得技通电子有限公司