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  您当前位置: 首页 >> 测试座/ 插座>>PGA测试座
socket/ic插座/老化测试座
IC插座封装分类

 

 

PGA/PGA封装 IC测试座/PGA老化座/PGA插座 IC Test and Burn-In Socket


PGA(pin grid array)的含义:陈列引脚封装。插装型封装之一,其底面的垂直引脚呈陈列状排列。封装基材基本上都采 用多层陶瓷基板。在未专门表示出材料名称的情况下,多数为陶瓷PGA,用于高速大规模逻辑 LSI 电路。成本较高。引脚中心距通常为2.54mm,引脚数从64 到447 左右。 了为降低成本,封装基材可用玻璃环氧树脂印刷基板代替。也有64~256 引脚的塑料PGA。 另外,还有一种引脚中心距为1.27mm 的短引脚表面贴装PGA(碰焊PGA)。


PGA

3M TEXTOOL PGA封装测试座/老化座PGA Test &Burn-in socket
3M为国际公认的研发领域的企业先驱,总部设在美国明尼苏达州的圣保罗市,是世界著名的多元化科技的创新型跨国企业。基于对40多个卓越科技平台的开发和交互使用,开发了成千上万种创新产品,以满足广泛市场领域的客户需求......详情请点击


PGA

TI PGA封装测试座/老化座PGA Test &Burn-in socket
得技通电子代理TI PGA封装多种系列型号测试座和老化插座产品。并提供TI PGA封装的所有产品型录和资料下
载......详情请点击


 
注:适配座均为易耗品,无保用

PGA

PGA测试座 PGA老化座 PGA Socket
3M Textool PGA Sockets
part #200-4660-14-1900
Lever actuated zero insertion force mechanism
Rugged 3-plate construction for durability and electrical reliability
Available with ush handle option for use with test probes and ease of board stacking
Available in 10 x 10 through 25 x 25 matrices
Contacts, handles, top-plate and cam plate are replaceable

PGA

PGA测试座 PGA老化座 PGA Socket

3M Textool PGA Kit Sockets
Available in 10 x 10 matrix through 25 x 25 matrix
Used when only a few test sockets are needed
Provides individual components ready for assembly
Open pattern top plate; load only those contacts needed for your specic device pin pattern

Part Number Matrix Size Description MFR.
200-6310-9UN-1900 10 x 10 Socket Kit w/o Contacts 3M Textool
200-6311-9UN-1900 11 x 11 3M Textool
200-6313-9UN-1900 13 x 13 3M Textool
200-6315-9UN-1900 15 x 15 3M Textool
200-6317-9UN-1900 17 x 17 3M Textool
200-6319-9UN-1900 19 x 19 3M Textool
200-6321-9UN-1900 21 x 21 3M Textool
200-6325-9UN-1900 25 x 25 3M Textool
300-6300-CNA-0002B Each Contact - BeCu/Au Plated 3M Textool
200-4660-14-1900 Set of 10 Extra Hole Plugs 3M Textool
 
PGA
SPGA测试座 SPGA老化座 SPGA Socket
3M Textool Shrink PGA Sockets
Applicable package for 1.27 mm (.050") pitch PGA
Zero insertion force
Double mating contact
Lever actuation mechanism
Maximum grid 37 x 37 and lead count of 600

PGA
IPGA测试座 IPGA老化座 IPGA Socket
3M Textool Interstitial PGA Sockets
17 x 17 outer matrix with 16 x 16 inner staggered matrix holds up to 432 leads
Lever actuated zero insertion force mechanism
Rugged 3-plate construction for durability and electrical reliability
Accommodates two lead diameter variations
.25 - .40 mm (.010" - .016") and
.35 - .51 mm (.014" - .020")

PGA
PGA测试座 PGA老化座 PGA Socket
WELLS-CTI 650/651 Series ZIP PGA Socket
Zero Insertion Force with normally closed contacts
650 Series has Left side actuation
651 Series has Right side actuation
High normal force Dual Beam contacts
Chamfered lead-in area for easy insertion of IC contacts
Normally closed balance beam contacts maintain constant pressure on device leads.
Designed for fully automatic loading and unloading of devices
Stress-free socket during burn-in

PGA
IPGA测试座 IPGA老化座 IPGA Socket
WELLS-CTI 681 Series ZIF IPGA Socket
Zero Insertion Force with normally closed contacts
Horizontal and vertical detents allow positive handle locations
Chamfered lead-in area for easy insertion of IC contacts
Keyed hole plug available for device orientation
Heatsink option available with thermal transfer interface

PGA
PGA测试座 PGA老化座 PGA Socket
WELLS-CTI 682 Series ZIF PGA Socket
Zero Insertion Force with normally closed contacts
Horizontal and vertical detents allow positive handle locations
Chamfered lead-in area for easy insertion of IC contacts
Keyed hole plug available for device orientation

PGA
PGA测试座 PGA老化座 PGA Socket
WELLS-CTI 683 Series ZIF PGA Socket
Zero Insertion Force with normally closed contacts
Horizontal and vertical detents allow positive handle locations
Chamfered lead-in area for easy insertion of IC contacts


Part Number Body Size Grid Row/Array Leads Pitch MFR.
PGA-296(420)-1.78-01 49.53X49.53 37X37 Staggered 296 1.78 ENPLAS
PGA-296(420)-1.78-02 49.53X49.53 37X37 Staggered 296 1.78 ENPLAS

 

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