socket/ic插座/老化测试座
IC插座封装分类
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Sensata SOJ封装测试座/老化座SOJ Test &Burn-in socket |
Sensata SOJ 封装测试座/老化座SOJ Test &Burn-in socket
Small Outline J–Leaded Packages (SOJ Series)
• |
Compact
design and small foot print ensure high density
mounting on the board |
• |
High
reliability with compound spring contact |
• |
Zero
insertion force to realize easy handling of IC
package in operation |
• |
Automatic machine applicable for loading/unloading |
• |
Open top |
Specifications
Current Rating |
Max. 1 Amp |
Insulation Resistance |
Min. 1,000 M ohm |
Dielectric Strength |
AC 1,000 V-RMS / 1 Min |
Initial Contact Resistance |
Max. 30m ohm at DC 10mA |
Operating Temperature |
-65°C to +150°C |
Durability |
Min. 10,000 Cycles |
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DIAGRAM
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Pin Availability
No. of Pos. |
A |
B |
C |
D |
E |
Mil |
IC Insertion |
2026 |
22.70 |
15.24 |
14.50 |
17.60 |
13.78 |
300 |
|
2026A |
22.70 |
15.24 |
15.37 |
17.60 |
13.78 |
300 |
|
24B |
21.43 |
13.97 |
15.37 |
16.33 |
13.78 |
300 |
|
2426 |
22.70 |
15.24 |
14.50 |
17.60 |
13.78 |
300 |
Dead |
26 |
22.70 |
15.24 |
14.50 |
17.60 |
13.78 |
300 |
Bug |
2426B |
22.70 |
15.24 |
15.37 |
17.60 |
13.78 |
300 |
|
26B |
22.70 |
15.24 |
15.37 |
17.60 |
13.78 |
300 |
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NUMBERING
1 = |
Series Name |
2 = |
Body Material-AA: PEI Glass Filled |
3 = |
Contact Finish-33: Gold Plating - 10µ" |
4 = |
Contact Pitch-A: 1.27mm |
5 = |
IC Package Row to Row, 0: 300 mil, A:
350 mil, B: 400 mil |
6 = |
Pin Numbers |
7 = |
Variation:
(Blank) : Socket Height 14.50mm
B : Socket Height 15.37mm |
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