Sensata-pga|Sensata-pga测试座|Sensata-pga老化测试座--深圳得技通电子有限公司

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基础测量仪器

您当前位置: 首页 >> 测试座/ 插座 >> Sensata 测试座 >> pga封装测试座/老化座

socket/ic插座/老化测试座

	YAMAICHI IC插座/socket
	ENPLAS IC插座/socket
	WELLS-CTI IC插座/socket
	3M Textool IC插座/socket
	Sensata Socket/老化座
	Plastronics IC插座/socket
	ARIES IC插座/socket
	Meritec IC插座/socket

IC插座封装分类

	BGA测试座/socket
	BGA(SMT)测试座/socket
	QFN测试座/socket
	QFP测试座/socket
	TSOP测试座/socket
	SOP测试座/socket
	PLCC测试座/socket
	CSP测试座/socket
	DIP测试座/socket
	SOT/TO测试座/socket
	TSOP(SMT)/socket
	PGA测试座/socket
	MLF测试座/socket
	SOJ测试座/socket

Sensata PGA封装测试座/老化座PGA Test &Burn-in socket

Sensata PGA 封装测试座/老化座PGA Test &Burn-in socket

Pin Grid Array (PGA) Series

•	A strong, metal cam activates the normally closed contacts preventing dependency on plastic for contact force
•	The handle can be provided on either the right– or left–hand side (Consult a product specialist for special requirements)

Specifications

Specifications	Socket body is black UL 94V-O polyphenylene sulfide (PPS) Contacts are either beryllium copper alloy 174, ½ hard or spinodal alloy Handle is stainless steel Contact current rating = 1 amp Accepts leads 0.014–0.026 (0.36–0.66) in diameter, 0.120–0.290 (3.05–7.37) long
Plating option for spinodal alloy contact	"6" 50&#micro; (1.27&#micro;m) min. nickel boron
Plating options for beryllium copper contact	"2": 30&#micro; (.76&#micro;m) min. Gold per Mil-G-45204 on contact area. 100&#micro; (2.54&#micro;m) min. Tin per Mil-T-10727 on solder tail, both over 30&#micro; (76&#micro;m) min. Nickel per QQ-N-290 all over. "3": 30&#micro; (.76&#micro;m) min. Gold per Mil-G-45204 on contact area. 10&#micro; (.25&#micro;m) min. Gold per Mil-G-45204 on solder tail, both over 30&#micro; (76&#micro;m) min. Nickel per QQ-N-290 all over.
Operating Temperatures	-85°F to 221°F (-65°C to 105°C) tin plating -85°F to 257°F (-65°C to 125°C) gold plating -85°F to 392°F (-65°C to 200°C) nickel plating spinodal
Mounting Considerations	Suggested PCB hole size = .032 ± .002 (.81 ± .05 dia.) Plugs into standard PGA sockets

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