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Click on Overview for further information about:
-Part Number Details
-Socket Dimensions Overview
(PDF file size: 44KB)
Selection of:
-PCB Layouts
-Matching IC Dim. |
225, 256, 342 pins
PDF file size: 79KB
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576 & 696 pins
PDF file size: 51KB
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729 pins
PDF file size: 130KB
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Title: Fine Ball Grid Array (FBGA) |
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Features |
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- Pin counts 169, 196, 209, 225, 256, 257, 324, 340, 484,576, 671, 696, 720, 729, 740 and 868
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- Pitch sizes 0.75, 0.8 and 1.0mm
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- Clamshell socket for FBGA packages
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- V-shape contact structure to lower the damage of coplanarity of solder balls
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Specifications |
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Insulation Resistance: |
1,000M min. at 500V DC |
Dielec. Withstd. Voltage: |
700V AC for 1 minute
for 1.0mm pitch
500V AC for 1 minute
for 0.8mm pitch
100V AC for 1 minute
for 0.75mm pitch |
Contact Resistance: |
30m max. at 10mA/20mV max. |
Operating Temp. Range: |
–40癈 to +150癈 |
Contact force: |
15g~35g within contact travel distance between 0.2~0.5mm |
Mating Cycles: |
10,000 insertions |
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Materials and Finish |
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Housing: |
Polyethersulphone (PES), glass-filled and Polyetherimide (PEI), glass-filled |
Contacts: |
Beryllium Copper (BeCu) |
Plating: |
Gold over Nickel |
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