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Click on Data Sheet for further information about:
-Part Number Details
-Socket Dimensions
-IC Dimensions
-PCB Layouts
See Table Below |
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Title: Ball Grid Array (BGA) |
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Features |
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- Any amount of pin counts are possible
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- Open top type sockets for BGA packages
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- Self contacting structure without upper pressing force (ZIF)
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- Changes to the IC ball flatness are minimized by contacting the ball from the side to protect it from damage
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Specifications |
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Insulation Resistance: |
1,000M min. at 500V DC |
Dielec. Withstd. Voltage: |
100V AC for 1 minute |
Contact Resistance: |
30m max. at 10mA/20mV max. |
Operating Temp. Range: |
–55癈 to +150癈
–40癈 to +170癈 max. for
NP276-11904-x |
Contact force: |
30g per pin approx. |
Mating Cycles: |
10,000 insertions |
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Materials and Finish |
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Housing: |
Polyetherimide (PEI), glass-filled
Polyetherssulphone (PES), glass-filled |
Contacts: |
Beryllium Copper (BeCu) |
Plating: |
Gold over Nickel |
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