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Click on Data Sheet for further information
about:
-Part Number Details
-Socket
Dimensions
-IC Dimensions
-PCB
Layout |
(PDF file size:
58KB)
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Title: Quad Flat Package
(QFP) |
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Features |
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Specifications |
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Insulation
Resistance: |
1,000M min. at 100V DC,
0.4,
0.5 pitch
1,000M min. at 500V DC,
0.65, 0.8 |
Dielec. Withstd.
Voltage: |
100V AC for 1
minute.
0.4, 0.5 pitch
500V AC
for 1 minute,
0.65 pitch |
Contact
Resistance: |
30m max. at 10mA/20mV
max. |
Operating Temp.
Range: |
–40癈 to
+170癈 |
Contact
Force: |
45g min. to 20g per
pin |
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Materials and
Finish |
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Housing: |
Polyetherimide (PEI), glass-filled
Polyphenylenesulfide (PPS),
glass-filled |
Contacts: |
Beryllium Copper (BeCu) |
Plating: |
Gold over
Nickel |
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