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Series X55X High-Temperature Universal Zero-Insertion-Force DIP Test Socket

FEATURES

Universal Test Socket accepts devices on 0.300 to 0.600 [7.62 to 15.24] centers All pin count sockets go into PCB with either 0.300 or 0.600 [7.62 or 15.24] centers Contacts are normally closed to eliminate dependence on plastic to sustain contact Socket handle can be configured with closed contacts (on) when in the UP or DOWN position, and can be mounted on either the right or left side Sockets can be soldered into PCBs. Socket fits into Aries’ test socket receptacle on Data Sheet 10003

X55X 系列高温通用 ZIF DIP 测试座

SPECIFICATIONS

Socket Body: natural UL 94V-0 Glass-filled Polyetheretherketone (PEEK)
Handle: Stainless Steel
Contacts: Beryllium-Nickel 360, 1/2-hard
Contact Plating: 50μ [1.27μm] Nickel-Boron
Contact Current Rating: 1 amp
Operating Temperature: minimum -67°F [-55°C]; maximum 482°F [250°C]
Retention Force (closed): 55 grams/pin based on a 0.020 [0.51] diameter test lead
Insulation Resistance: 1000 MOhms minimum
Dielectric Withstanding Voltage: 1000 VAC
Life Cycle: 25,000 to 50,000 cycles
Accepts Leads: 0.015-0.045 [0.38-1.14] wide, 0.110-0.280 [2.79-7.11] long

MOUNTING CONSIDERATIONS

See socket footprint below
DO NOT LEAVE THE SOCKET ON THE “CONTACT OPEN” OR “OFF POSITION” WHILE UNDER TEMPERATURE IN THE BURN-IN OVEN






 

 

 

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